발행물
컨퍼런스
2016 International Conference on Planarization/CMP Technology (ICPT 2016)
2019
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Analysis of Pad Surface Change Using the Optical Sensor in Real Time_Seokjun Hong, Hyunjae Chung, Cheolmin Shin, Taesung Kim (Oral Presentation*)
Study of Stress Distributions on the Wafer at the CMP Process Using Numerical and Experimental Methods_Jinwoo Park, Cheolmin Shin, Hongyi Qin,Taesung Kim (Oral Presentation*)
Effects of Slurry Additives under Acid Condition for 3D NAND gate Flash Memory_Sanghuck Jeon, Taesung Kim (Poster Presentation*)
HLD CMP Screatch on Gate Last Process_Sungil Cho, Kyungil Cho, Jinwoo Kim, Taesung Kim (Poster Presentation*)
Effect of Slurry Additives on Material Removal Rate and Nanoscale Surface Uniformity of Cu Wafers During CMP_Sungjae Jang, Jung Hwan Song, Taesung Kim (Poster Presentation*)