2018

,

Effects of Dispersants on Particle Size Distribution and Chemical Mechanical Polishing Process_Eungchul Kim, Jaewon Lee, Gunhoo Woo, Taesung Kim (Oral Presentation)

2018

,

Investigation of Colloidal Silica Slurry with Mixed Particles of Different Sizes in Cu CMP_Juhwan Kim, Seokjun Hong, Chulwoo Bae and Taesung Kim (Oral Presentation)

2018

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Application of Scanning Mobility Particle Sizer for Measurement of Slurry Abrasive Size_Donggeon Kwak, Jinil Cho, Hyunho Seok, Taesung Kim (Oral Presentation)

2018

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Optimization of Water Polishing for an Improved Abrasive Removal_Seokjun Hong, Juhwan Kim, Johee Won, Vinit Kanade, Taesung Kim, Yutaka Wada, Satomi Hamada, Hirokuni Hiyama (Oral Presentation)

2018

,

A Numerical Study on Slurry Flow with CMP Pad Grooves_Seokjun Hong, Johee Won, Hojoong Kim, Vinit Kanade, Taesung Kim (Oral Presentation)