발행물
컨퍼런스
ICPT 2017 (International conference on planarization/CMP technology)
2017
,
Development of novel cleaning solution for post chemical mechanical planariztion silicon wafer
Study on defect control of CMP process caused by deposition process
Modified Kinematic model for predicting contact points of conditioner in CMP
Study on hydrodynamic pressure distribution in chemical mechanical polishing
Prediction of cmp performance with slurry flow analysis on the pad surface