발행물
컨퍼런스
2019 SPCC (The Surface Preparation and Cleaning Conference)
2003
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Investigation of Ceria Abrasive Removal during Post Chemical Mechanical Polishing Cleaning_Juhwan Kim, Seokjun Hong, Vinit K.Kanade, Taesung Kim (Poster Presentation)
2018 International Conference on Planarization/CMP Technology (ICPT 2018)
2017
A method for size distribution measurement of sub-100nm colloidal silica nanoparticles_Cheolmin Shin, Donggeon kwak, Seungki Chae, Yinhua Jin and Taesung Kim (Poster Presentation)
Effects of Amino Acids for High Silicon Oxide Removal Rate_Donggeon Kwak, Cheolmin shin ,Vinit K. Kanade and Taesung Kim (Poster Presentation)
Prediction of Pad Profile during Conditioning Process in Chemical Mechanical Polishing_Eungchul Kim, Chul Kang, Jichul Yang, Yinhua Jin, and Taesung Kim (Poster Presentation)
Investigation of Abrasive Behavior during Water Polishing_Seokjun Hong, Juhwan Kim, Vinit K. Kanade, Taesung Kim, Wada Yutaka, Hiyama Hirokuni and Satomi Hamada (Poster Presentation)