발행물
컨퍼런스
2017 International Conference on Planarization/CMP Technology (ICPT 2017)
2013
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Study on hydrodynamic pressure distribution in chemical mechanical polishing_Eungchul Kim, Cheolmin Shin, Yinhua Jin, Taesung Kim (Poster Presentation*)
Evaluation of polyurethane pads properties for effective use in planarization process_Hyunjae Chung, Cheolmin Shin, Yinhua Jin, Taesung Kim (Poster Presentation*)
Control of silica particle deposition for fabrication of post cmp cleaning ability evaluation wafer_Younsun Cho, Seung-Ki Chae, Cheolmin Shin, Yinhua Jin, Taesung Kim (Poster Presentation*)
Prediction of cmp performance with slurry flow analysis on the pad surface_Seokjun Hong, Younsun Cho, Juhwan Kim, Yinhua Jin, Taesung Kim (Poster Presentation*)
The effect of chelating agent in TMAH based post Cu-CMP cleaning solution_Seongsik Jeon, Sanghyuk Jeon, Ahhyeon Lim, Sokho Yi, Taesung Kim (Poster Presentation*)