발행물
컨퍼런스
2017 International Conference on Planarization/CMP Technology (ICPT 2017)
2013
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In-line real-time conductivity technique for monitoring of liquid chemical concentration during semiconductor manufacturing_Hong Jie, Atul Kulkarni, Hyeong-U Kim, Taesung Kim (Poster Presentation*)
Improvement of wafer edge profile by controlling a pad profile_Seokjoon Kim, Siyoung Kim, Taesung Kim (Poster Presentation*)
A reverse selectivity ceria slurry for silicon nitride removal during CMP_Hyunsu Lim, Youngse Lee, Taesung Kim (Poster Presentation*)
Development of novel cleaning solution for post chemical mechanical planariztion silicon wafer_Junghwan Shong, Na Han, Kihong Park, Sokho Yi, Taesung Kim (Poster Presentation*)
Study on defect control of CMP process caused by deposition process_Sungbin Lee, Sangyoon Shin, Taesung Kim (Poster Presentation*)