발행물
컨퍼런스
The 22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
2024
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The Study on Crosstalk for the Silicon Interposer
International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
Impact of TSV Configuration on Thermal Performance of High Bandwidth Memory
International SoC Design Conference
Modeling of Chiplet-based 2.5D Packaging with Silicon Bridge
International meeting on intormation display
Challenges on micro display driver ICs
2024 sid display week symposium
A Low Power Digital Logic Structure for High Resolution and High Frame Rate OLEDoS Micro Displays