As the use of high-speed signals continues to grow, precisely controlling signal loss has become an increasingly challenging task in the electronics industry. This paper focuses on dielectric loss that occurs in transmission channels during high-speed signaling and proposes a novel printed circuit board (PCB) structure to effectively mitigate such loss. To evaluate the feasibility of the proposed structure, electromagnetic simulations were conducted to analyze the electrical characteristics of the PCB. Furthermore, in order to reduce additional manufacturing costs, a practical PCB fabrication method that does not require high-end equipment was developed, and a prototype was manufactured. Finally, using a vector network analyzer (VNA), the electrical performance and signal quality improvement of the prototype were thoroughly evaluated. The experimental results demonstrate that the proposed structure can effectively reduce dielectric loss in the transmission channel while minimizing the need for expensive low-loss dielectric materials, making it a cost-efficient solution for high-speed PCB applications.