기본 정보
연구 분야
프로젝트
논문
구성원
article|
인용수 2
·2024
Packaging and Antenna-Assembled Hybrid Stacked PCB with Novel Vertical Transition for 39 GHz 5G Base Stations
Young-Ju Lee, Dohyuk Ha, Kwang‐Hyun Baek, Juneseok Lee, Sang‐Hoon Park, Jung Ho Park, Jinsu Heo, Jae Hee Kim
IF 1.7Journal of Electromagnetic Engineering and Science
초록

This paper proposes a novel packaging and large-scale antenna-assembled structure for a printed circuit board (PCB) that reinforces productivity, facilitates cost reduction, and maintains reliability. This was achieved by splitting the antenna from the main board and packaging it into a radio-frequency integrated circuit. In addition, two innovative solutions—an externally attachable flexible PCB antenna and a PCB-embedded coaxial line—are introduced to overcome the degradation in antenna performance and vertical RF transition loss in the proposed low-cost hybrid PCB. First, the proposed externally attachable flexible PCB antenna and a parasitic aircoupled antenna, which were easily assembled on the PCB, achieved an antenna efficiency of 95% and an impedance bandwidth of 7 GHz. Second, the fabricated coaxial line exhibited enhanced impedance matching over a wide frequency range of 30–40 GHz and improved insertion loss of approximately 1.4 dB. Furthermore, the packaged antenna, composed of 256 dual-polarized antenna elements per stream, incorporated a 39 GHz CMOS-based 16-channel phased-array transceiver IC. The set-level beam-forming measurements were verified considering an effective isotropic radiated power of 55 dBm at boresight and a steering range >±60°. In addition to being suitable for mass production in terms of cost and reliability, the proposed structures and solutions met the required antenna and beam-forming performance for commercial 39 GHz base stations without sacrificing performance.

키워드
Base (topology)Antenna (radio)Base stationElectrical engineeringOptoelectronicsMaterials scienceTelecommunicationsElectronic engineeringEngineeringMathematics
타입
article
IF / 인용수
1.7 / 2
게재 연도
2024

주식회사 디써클

대표 장재우,이윤구서울특별시 강남구 역삼로 169, 명우빌딩 2층 (TIPS타운 S2)대표 전화 0507-1312-6417이메일 info@rndcircle.io사업자등록번호 458-87-03380호스팅제공자 구글 클라우드 플랫폼(GCP)

© 2026 RnDcircle. All Rights Reserved.