An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface With On-Chip Quantized Time-Domain Feature Extraction
Pyeon, YJ, Cho, J, Choi, G, Yeom, J, Kim, H, Cho, S, Kim, Y, Kim, T, Kwak, J-H, Cho, W, Jeong, W, Kim, MW, Lee, YS, Shin, H, Jeong, HE, Kim, JJ
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 202504