한승호 교수 연구실
article|
인용수 1
·2024
Pressure Distribution and Wear of Grinding Wheel in Ultra-Thinning Process of LiTaO3 Wafer
Haeseong Hwang, Seung Ho Han, Hyunseop Lee
International Journal of Precision Engineering and Manufacturing
키워드
GrindingMaterials scienceMachiningGrinding wheelWaferReciprocating motionComposite materialPolishingMechanical engineeringMetallurgy