정하영 교수 연구실
article|
hybrid
·인용수 0
·2025
Corrigendum to “Molecular dynamics study of grain size effects on interfacial voids in Cu–Cu diffusion bonding” [Appl. Surface Sci. 720 (2026) 165145]
Junhyeok Park, Juheon Kim, Minki Jang, Byungjo Kim, Hayoung Chung
IF 6.9Applied Surface Science
키워드
Dynamics (music)Grain sizeDiffusionSurface (topology)Surface diffusion