정하영 교수 연구실
preprint|
green
·인용수 0
·2025
Molecular Dynamics Study of Grain Size Effects on Interfacial Voids In Cu-Cu Diffusion Bonding
Junhyeok Park, Juheon Kim, Minki Jang, Byungjo Kim, Hayoung Chung
SSRN Electronic Journal
키워드
Grain sizeMolecular dynamicsDiffusionMaterials scienceCopperChemical physicsDynamics (music)MetallurgyCrystallographyChemical engineering