김보현 교수 연구실
article|
인용수 0
·2026
Experimental study on micro grinding of silicon wafer using polycrystalline diamond tool
Jae Yeon Kim, Ji Hyo Lee, Won Chan Park, Bo Hyun Kim
IF 1.7Journal of Mechanical Science and Technology
키워드
GrindingWaferMachiningSurface roughnessSiliconDiamondDiamond grindingSubstrate (aquarium)Surface finish