Advancements in semiconductor packaging technology have increased the demand for precise testing equipment. Pogo pins play a crucial role in semiconductor package inspection systems by providing reliable electrical connectivity during testing. However, as semiconductor circuits become increasingly fine-pitched, pogo pins must be reduced in size and diameter. This reduction makes it challenging to balance mechanical durability with electrical performance. Particularly with the rise of high-frequency components, developing pogo pins that minimize interference with high-frequency measurements is becoming essential.This review examines recent developments in pogo pin technology for semiconductor package inspection. Pogo pins are classified based on their materials and structural designs, analyzing how these factors impact reliability and electrical measurement accuracy. Mechanical properties, such as hardness and wear characteristics, and electrical properties, including contact resistance and impedance, are also thoroughly explored. Based on these findings, an optimized pogo pin design strategy is proposed, focusing on enhanced durability and improved testing accuracy for semiconductor packages.