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·2025
Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study
Vijay D. Chavan, Touko Lehenkari, Suhas Yadav, Ruhan E. Ustad, Zulfqar Ali Sheikh, Ajay T. Avatare, Tushar P. Kamble, Laraib Sajjad, Hannu‐Pekka Komsa, Sandip Sabale, Kyeong-Keun Choi, Seungbae Park, Ghulam Dastgeer, Honggyun Kim, Deok‐kee Kim
Materials Today Nano
키워드
Reliability (semiconductor)CopperTungstenDiffusion barrierMaterials scienceElectronic packagingTungsten disulfideDiffusionIntegrated circuit packagingNanotechnology