이상한 교수 연구실
preprint|
green
·인용수 0
·2025
Cuag Alloy-Driven Low-Temperature Bonding for Advanced 3d Packaging
Jae-Ho Jun, Sanghan Lee, Yong Kyu Lee, Yong Ho Ko, Chang Woo Byun, Hee-Soo Kim, Soyeon Lee, Byoung-Joon Kim
SSRN Electronic Journal
키워드
AlloyMaterials scienceMetallurgyComposite material