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·2025
Fault Bounding On-Die BCH Codes for Improving Reliability of System ECC
Seongyoon Kang, Chaehyeon Shin, Jongsun Park
IF 3.1IEEE Transactions on Very Large Scale Integration (VLSI) Systems
초록

While continuous dynamic random access memory (DRAM) scaling may require an on-die error correction code (ECC) with enhanced correction capability, a double error correcting code with fault bounding scheme has not been explored. In this brief, we present the fault bounding on-die Bose–Chaudhuri–Hocquenghem (BCH) code that improves the compatibility with one-symbol error correcting system ECC used in dual data rate five (DDR5) dual in-line memory module (DIMM). By modifying the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">H</i> matrix of BCH code, the proposed decoding method determines the fault boundary within which burst errors occur, effectively preventing the spread of these errors across fault boundaries. A comparison of bounded rates with conventional codes illustrates the enhanced compatibility with system ECC. The encoder and decoder of the proposed code have been implemented using a 28-nm CMOS process to demonstrate the hardware cost.

키워드
BCH codeDie (integrated circuit)Reliability (semiconductor)Reliability engineeringComputer scienceBounding overwatchArithmeticMathematicsAlgorithmEngineering
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article
IF / 인용수
3.1 / 0
게재 연도
2025