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·2025
An Overview of AI Hardware Architectures and Silicon for 3-D Spatial Computing Systems
Dongseok Im, Gwangtae Park, Junha Ryu, Hoi‐Jun Yoo
IEEE Open Journal of the Solid-State Circuits Society
초록

As artificial intelligence (AI) advances, 3D spatial computing has emerged as a key application in various fields. It interprets the 3D space surrounding users and provides them with useful information. This paper presents a survey of AI hardware architectures and silicon solutions for 3D spatial computing systems. The survey categorizes five domains: 3D data capturing, 3D data analysis, 3D hand motion analysis, simultaneous localization and mapping (SLAM), and 3D rendering. Each session analyzes design considerations for domain-specific accelerators. Finally, the paper discusses a next-generation 3D spatial computing platform that integrates various functions of 3D spatial computing systems using AI technologies.

키워드
Computer scienceComputer architectureEmbedded systemOperating systemComputer hardware
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article
IF / 인용수
- / 1
게재 연도
2025

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