이은호 교수 연구실
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Crystal Plasticity-Based Modeling and Experimental Validation of the Influence of Microstructures and Grain Boundary Junction Types on the Cu-Cu Bonding Interface
구분
국외
국가
미국
컨퍼런스명
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
발표 제목
Crystal Plasticity-Based Modeling and Experimental Validation of the Influence of Microstructures and Grain Boundary Junction Types on the Cu-Cu Bonding Interface
기관명
IEEE
참여 연도
2025
상세 설명
IEEE