이은호 교수 연구실
IEEE 75th Electronic Components and Technology Conference (ECTC)
An Effective 3D Thermal Network Integrated With Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns
구분
국외
국가
미국
컨퍼런스명
IEEE 75th Electronic Components and Technology Conference (ECTC)
발표 제목
An Effective 3D Thermal Network Integrated With Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns
기관명
IEEE
참여 연도
2025
상세 설명
IEEE