이은호 교수 연구실
International Conference on Plasticity, Damage, and Fracture
CONSTITUTIVE MODELING FOR MULTI-SCALE SIMULATION OF BUMPLESS HYBRID BONDING PROCESSES IN SEMICONDUCTOR DIE STACKING FOR HIGH-PERFORMANCE COMPUTING SYSTEM
구분
국외
국가
오스트레일리아
컨퍼런스명
International Conference on Plasticity, Damage, and Fracture
발표 제목
CONSTITUTIVE MODELING FOR MULTI-SCALE SIMULATION OF BUMPLESS HYBRID BONDING PROCESSES IN SEMICONDUCTOR DIE STACKING FOR HIGH-PERFORMANCE COMPUTING SYSTEM
기관명
Interntional Journal of Plasticity
참여 연도
2026
상세 설명
Interntional Journal of Plasticity