이은호 교수 연구실
article|
인용수 1
·2025
A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations
Jeong-Hyeon Park, Eun Hye Lee, I.W. Kim, Hyun-Woo Jung, Jihyun Kim, Jungwan Cho, Jong‐hyoung Kim, Tae‐Ik Lee, Seung‐Kyun Kang, Eun‐Ho Lee
IF 4.6Materials Science in Semiconductor Processing
키워드
MicroelectronicsProperty (philosophy)Characterization (materials science)Material properties