발행물

전체 논문

138

1

Scalable and Fast Electrical Modeling Method for Bonding-Wire Memory Pa...
Dongryul Park Seonghi Lee, Seunghun Ryu, Hyunwoo Kim, Duksoo Kim,...
International Journal, 2025.07

2

A Fast SerDes Equalizer Effect-Included Worst Eye Diagram Estimation Me...
Seonghi Lee , Seunghun Ryu, Sanguk Lee, Hyunwoong Kim, Seongho ...
International Journal, 2025.02

3

Design of Resonant Circuit Components to Suppress both EMF and EMI in W...
Seongho Woo , Yujun Shin; Jaewon Rhee; Sungryul Huh; Seungyoung...
International Journal, 2025.02

4

A 3-port Network-based Capacitance Measurement Method for Asymmetric Ha...
Jaewon Rhee Seongho Woo, Yujun Shin, Jiseong Kim, Seungyoung Ahn
International Journal, 1970

5

A Dual Current Probes Method with Enhanced Low-Frequency Sensitivity fo...
Jaewon Rhee Changmin Lee, Sanguk Lee, Seongho Woo, Yujun Shin, ...
International Journal, 1970

6

Resonance Circuit Design Eliminating RX-Side Series Capacitor in LCC-LC...
Yujun Shin Jaewon Rhee, Seongho Woo
International Journal, 1970

7

Frequency-Selective Suppression Method of Harmonic Magnetic Field for Double-Sided LCC Wireless Power Transfer Systems
Ahn, Seungyoung, Woo, Seongho, Rhee, Jaewon, Lee, Hyunsoo, Shin, Yujun, Kim, Hongseok
IEEE TRANSACTIONS ON POWER ELECTRONICS, 202504

8

One-Step Method of Dynamic Capacitances Extraction From a SiC Power MOSFET in a Half-Bridge Package for EMI Analysis
Ahn, Seungyoung, Woo, Seongho, Rhee, Jaewon, Lee, Changmin, Lee, Sanguk, Kim, Ji Seong, Kim, Hongseok
IEEE TRANSACTIONS ON POWER ELECTRONICS, 202501

9

A Simple Characterization Method for Parasitic Capacitance Extraction of SiC Power MOSFETs Integrated Half-Bridge Configuration
Ahn, Seungyoung, Rhee, Jaewon, Lee, Sanguk, Kim, Hongseok, Kim, Ji Seong
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 202412

10

Optimization of the Power/Ground Ball Map in 3-D-IC BGA Packages With Multiple Power Domains Using Deep Reinforcement Learning
Ahn, Seungyoung, Park, Dongryul, Woo, Seongho, Lee, Seonghi, Ryu, Seunghun, Lee, Sanguk, Kim, Hyunwoo, Kim, Hyunwoong, Yong, Seokbeom, Song, Sangsub
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202411