기본 정보
연구 분야
프로젝트
발행물
구성원
review|
hybrid
·인용수 0
·2025
Smart Mechanical Structures and Design for Advanced Adhesives: A Review
J.S. Kim, Geonjun Choi, Seongjin Park, Minwook Kim, Kwangjun Kim, Ho‐Sup Jung, Moon Kyu Kwak, Jong G. Ok, Hoon Eui Jeong
IF 3.6International Journal of Precision Engineering and Manufacturing
초록

Abstract Smart adhesives with engineered mechanical structures have emerged as a transformative technology with broad applications in fields such as wearable healthcare devices, bioengineering, and soft robotics. By integrating advanced mechanical architectures like kirigami, tessellations, and multilayered designs, these adhesives exhibit enhanced surface and mechanical properties that lead to superior interfacial adhesion. Such designs offer critical advantages—improved stretchability, substrate conformability, and increased adhesion strength—over conventional adhesives. This review explores the range of engineered structures used in smart adhesives and demonstrates how these innovations address the limitations of traditional adhesives. Additionally, we discuss their applications in wearable healthcare devices, flexible electronics, and robotics.

키워드
EngineeringAdhesiveConstruction engineeringArchitectural engineeringMaterials scienceForensic engineeringNanotechnology
타입
review
IF / 인용수
3.6 / 0
게재 연도
2025