김병조 교수 연구실
article|
·
인용수 1
·2025
Molecular dynamics study of grain size effects on interfacial voids in Cu Cu diffusion bonding
Junhyeok Park, Juheon Kim, Minki Jang, Byungjo Kim, Hayoung Chung
IF 6.9Applied Surface Science
키워드
Void (composites)Grain boundary diffusion coefficientGrain sizeGrain boundaryMolecular dynamicsCrystalliteSurface diffusionAtomic diffusionSurface roughness