Cryogenic atomic layer etching of SiO2 using CH2F2/Ar plasma for improved process window for nanoscale fabrication
Ji Hwan Kim, Jae Hyeon Kim, Gahong Lee, Yu Jin Heo, Gilgueng Hwang, Y. Cheon, Hyundeuk Cheon, Young Kyu Jeong, In Hyeok Kho, H. Shin, Changhee Lee, In Young Bang, Ranju Jung, Gi-Chung Kwon