Etching characteristics of NF3 and F3NO at reactive ion etching plasma for silicon oxide and silicon nitride
Woo-Jae Kim, In Young Bang, Ji Hwan Kim, Yeon Soo Park, Hee Tae Kwon, Gi Won Shin, Min‐Ho Kang, Yongjun Cho, Byung-Hyang Kwon, Jung Hun Kwak, Gi-Chung Kwon