발행물
컨퍼런스
한국마이크로전자 및 패키징학회 추계 기술심포지움
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Thermal effects of delamination in light emitting diode packages
한국마이크로전자 및 패키징학회 추계기술심포지움
Thermal analysis of GaN-based LED package using FVM and FEM
High power LED package의 광출력과 렌즈형성에 따른 열거동 분석
Int.Workshop on thermal investigations of IC`s and systems
Mechanism and thermal effect of delamination in light emitting diode packages
6th International Conference on Nitride Semiconductors
Thermal analysis GaN-based Laser Diode Package