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A New Graduate Packaging Course in Electronics Course in Electronics - High-speed Digital Interconnection and Packaging

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Microwave Modeling and Characterization of Anisotropic conductive Adhesive Flip-Chip Interconnection

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Verification of Picosecond Sampling for Electromagnetic Transient Scattering Experiment in Terahertz Spectrum Region

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A Novel Time domain Picosecond Pulse Sampling System for Non-contact Characterization of Liquids Semiconductors, and Metals

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Dynamic Full Wave Equation 을 이용한 RF Coil 의 자기장 분포 해석 프로그램을 이용한 3T RF Coil 의 성능 비교