한국표면공학회 추계학술대회
Influence of Ru-S on Electrodeposited Cu on Ru after Potentiostatic Surface Activation in Sulfuric Acid
2025
2025
한국표면공학회 추계학술대회
Thermally Reliable Through Glass Via Filling with Ni-Fe Alloy for Advanced 3D Packaging
2025
2025
The 23rd International Symposium on Microelectonics and Packaging(ISMP)
Electrodeposition of (111)-Oriented Cu Using Reducing Agent for Cu?Cu Direct Bonding
2025
2025
The 23rd International Symposium on Microelectonics and Packaging(ISMP)
Additive-Free DC Electrodeposition of (111)-Oriented Nanotwinned Copper for Reliable Cu?Cu Bonding
2025
2025