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21
Effect of Plasma Treatment Conditions of PDMS Substrate on Copper Electroless Plating Process.
Y. S. Park, J. H. Shin, I. Lee, T. An, G. H. Kim*
Journal of Korean Society of Manufacturing Process Engineers, 2023
22
Syringe Pump 3D Modeling for Precise Control of VCM.
J.S.Hwang, G.H.Kim*
Journal of Industrial Science and Technology Institute, 2023
23
The Influence of FFF Layer Printing Time On the Shape Errors.
K. S. Woo, G. H. Kim*
Journal of Industrial Science and Technology Institute, 2022
24
Fabrication of a Porous Carbon Surface Using Ethanol Vapor Treatment.
D. Im, G. H. Kim*, T. An*
Journal of Sensor Science and Technology, 2022
25
In Situ BSA (Bovine Serum Albumin) Assisted Electroless Plating Method with Superior Adhesion Property.
G. H. Kim, H.Y. Hwang, T. An
Advanced Materials Interfaces, 2022
26
Highly flexible and transparent film heater with electrospun copper conductive network via junction-free structure.
H. Woo, S. Kim, S. Yoon, K. Kim, G. H. Kim*, T. An*, G. Lim*
Journal of Alloys and Compounds, 2021
27
Au hierarchical nanostructure-based surface modification of microelectrodes for improved neural signal recording.
H. Woo, S. Kim, H. Nam, W. Choi, K. Shin, K. Kim, S. Yoon, G. H. Kim*, J. Kim*, G. Lim*
Analytical Chemistry, 2021
28
Sensors for biosignal/health monitoring in electronic skin.
H. S. Oh†, C. H. Lee†, N. K. Kim†, T. An, G. H. Kim*
Polymers, 2021
29
Pt Nanostructure Deposition on Microelectrodes for Improved Electrochemical Characteristics
H. Woo, S. Kim, S. Yoon, T. An, G. H. Kim*, G. Lim*
Transactions of the Korean Society of Mechanical Engineers - B, 2021
30
Fabrication of oblique submicron-scale structures using synchrotron hard X-ray lithography
K. Kim, K. Park, H. Nam, G. H. Kim, S. K. Hong, S. Kim, H. Woo, S. Yoon, J. H. Kim, G. Lim
Polymers, 2021
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