발행물
컨퍼런스
Conference of Science&Technology for Integrated Circuits (CSTIC), Semicon China
2025.03
,
Heterogeneous 3D CFET with Hybrid Channel Configuration
IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
Heterogeneous and monolithic 3D (HM3D) Integration of III-V and CMOS for next-generation wireless communication
2024 International Electron Devices Meeting (IEDM)
2024.12
Heterogeneous and Monolithic 3D (HM3D) Integrated RF Circuits: HM3D Integration of InGaAs HEMTs on CMOS-Based Backside Passive Devices
Vertically Integrated Active Power Delivery Network (PDN) for Heterogenous 3D (H3D) Stacked Systems: 3D On-chip Integration of GaN Power Devices on PDN with Direct Heat Spreading Layer Bonding