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전체 특허
Layout structure between substrate, micro-led array and micro-vacuum module for micro-led array transfer using micro-vacuum module, and method for manufacturing micro-led display using the same
US 11/295,972
Method for fabricating flexible electronic device through physical separation using phase change of thin film
KR 10-2224058
Ultra-thin transparent flexible vertical micro light emitting diode and manufacturing the same
KR 10-2046982
Active-matrix RGB vertical microLED display using transfer member and selective-transferring method
KR 10-2095215
Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device
US 10/290,785
Transferring and packaging apparatus for fabricating the electronic device
KR 10-2009492
Micro-vacuum module for Semiconductor Device Transfer and Method for Transferring Semiconductor Device Using the Micro-Vacuum Module
US Patent App. 16/225,178
Physical lift-off technique by thin-film phase transition, and method for flexible electronic devices using physical lift-off
KR 10-2224058
Laminating structure of electronic device using transferring element and method for fabricating the electronic device
KR 10-2017-0062349
Transfer-free flexible vertical light emitting diode and manufacturing method therefor
PCT/KR2016/010907, KR 10-1718652
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