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인용수 0
·2025
A strategy for monitoring the influence of moisture on the Cu/low-k interconnect patterning and reliability in the manufacturing process
Ki Dong Yang, Jaehyeong Lee, Eunji Hwang, Byoung-Wook Woo, Nam-Ho Lee, Hoomi Choi, Eunyoung Han, Young Jeong Kim
IF 1.9 (2025) Microelectronics Reliability
키워드
Reliability (semiconductor)InterconnectionProcess (computing)Manufacturing processMoistureReliability engineeringMaterials scienceComputer scienceProcess engineeringManufacturing engineering
타입
Article
IF / 인용수
1.9 / 0
원문
https://doi.org/10.1016/j.microrel.2025.115894
게재 연도
2025