멀티스케일 열공학연구실
중앙대학교 본교(제1캠퍼스) 기계공학부
이성혁 교수
Heat Transfer
Thermal Management
Nanomaterials
발행물
전체 논문
211
111
Evaporation characteristics of sessile droplets on nano-patterned hydrophobic surfaces
Dong Hwan Shin, Seong Hyuk Lee, Scott Retterer, Chang Kyoung Choi
Journal of Heat Transfer Transactions of the ASME,
112
The evaporation and wetting dynamics of sessile water droplets on submicron-scale patterned silicon hydrophobic surfaces
Dong Hwan Shin, Seong Hyuk Lee, Chang Kyoung Choi, Scott Retterer
Journal of Micromechanics and Microengineering,
113
Characteristics of thermosonic anisotropic conductive adhesives (ACFs) flip-chip bonding
Jong-Min Kim, Yong Song, Minhaeng Cho, Seong Hyuk Lee, Young-Eui Shin
Materials Transactions,
114
Wetting transition characteristics on microstructured hydrophobic surfaces
Jae Bong Lee, Hyuk Rok Gwon, Seong Hyuk Lee, Minhaeng Cho
Materials Transactions,
115
Hybrid interconnection process using solderable ICAs with low-melting-point alloy fillers
Byung-Seong Yim, Jong-Min Kim, Sung-Ho Lee, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han, Minhaeng Cho
Materials Transations, 2009
116
Self-organized interconnection process using solderable ACA (Anisotropic Conductive Adhesive)
Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han, Yong-Sung Eom, Young-Eui Shin
Materials Transactions,
117
Numerical analysis of coalescence characteristics of low melting point alloy fillers using a non-equilibrium phase field model
Jae Hyung Kim, Jung Hee Lee, Jong Min Kim, Seong Hyuk Lee
Materials Transactions,
118
Evaporating characteristics of sessile droplet on hydrophobic and hydrophilic surfaces
Dong Hwan Shin, Seong Hyuk Lee, Jung Yeul Jung, Jung-Yul Yoo
Microelectronics Engineering,
119
Characteristics of Sn-2.5 Ag flip chip solder joints under thermal shock test conditions
Kyoung Chun Yang, Seong Hyuk Lee, Jong-Min Kim, Young Ki Choi, Dave F. Farson, Young Eui Shin
Journal of Mechanical Science and Technology,
120
Optical characteristics and nanoscale energy transport in thin film structures irradiated by nanosecond-to-femtosecond lasers
Kwangu Kang, Seong Hyuk Lee, Hong Sun Ryou
Materials Transactions, 2008