발행물
컨퍼런스
The 10th International Conference on Advances in Materials and Processing Technology, Materials and Processing Technology
2007.10
,
Finite Element Modeling and Simulation for Bending Analysis of Multi-Layer Printed Circuit Boardsusing Woven Fiber Composite
29th -30th International Manufacturing Conference 2007, International Manufacturing Conference
2007.08
Numerical and Experimental Investigation on Improvement of Flexural Strength of Hybrid Multi-Layer Printed Circuit Boards
A Study on Design Variable for Multistage Seamed Part of Mechanical Bonded Structure
2007 AUVSI, ASSOCIATION FOR UNMANNED VEHICLE SYSTEMS INTERNATIONAL
Dedign and Intergration of Small Coaxial Unmanned Aerial Vechicle
KEY ENGINEERING MATERIALS, Trans Tech Publications LTD
2007.06
Preform Design for Formability Enhancement of Tube hydroforming Process using Deformation History