장건수 교수 연구실
article|
인용수 0
·2025
Heterojunction bilayer stainless steel/polyamide 66 composites bonded by epoxy resins containing various curing agents
Seung-In Song, Hayeong Lee, Keon‐Soo Jang
IF 3.5International Journal of Adhesion and Adhesives
키워드
Materials scienceEpoxyComposite materialAdhesivePolyamideCuring (chemistry)BilayerEpoxy adhesiveLayer (electronics)Membrane