Heterojunction bilayer stainless steel/polyamide 66 composites bonded by epoxy resins containing various curing agents | 장건수 교수 연구실 | Department of Polymer Engineering, School of Chemical and Materials Engineering

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·2025

Heterojunction bilayer stainless steel/polyamide 66 composites bonded by epoxy resins containing various curing agents

Seung-In Song, Hayeong Lee, Keon‐Soo Jang

International Journal of Adhesion and Adhesives

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Materials scienceEpoxyComposite materialAdhesivePolyamideCuring (chemistry)BilayerEpoxy adhesiveLayer (electronics)Membrane

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2025