Heterojunction Bilayer Stainless Steel/Polyamide 66 Composites Bonded by Epoxy Resins Containing Various Curing Agents | 장건수 교수 연구실 | Department of Polymer Engineering, School of Chemical and Materials Engineering

홈

연구 영역

기본 정보

논문·특허

과제

구성원

Preprint|

인용수 0

·2025

Heterojunction Bilayer Stainless Steel/Polyamide 66 Composites Bonded by Epoxy Resins Containing Various Curing Agents

Hayeong Lee, Seung-In Song, Keon‐Soo Jang

SSRN Electronic Journal

키워드

EpoxyPolyamideCuring (chemistry)Composite materialMaterials scienceBilayerChemistryMembrane

타입

Preprint

IF / 인용수

- / 0

원문

게재 연도

2025