발행물
컨퍼런스
The 20th International Symposium on Microelectronics and Packaging
2022
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A Study on the Pressure Sensor Mounted onto the 3D Printed Prosthetic Socket for Motion Monitoring
High performance and reusable SAW sensor coated with POSS-thiourea based polymer for DMMP detection
Triangular Beads like Structure of CuO and CuCo2O4 decorated Nitrogen doped_Graphene oxide for CWAs simulant detection
Effect of the Polyphosphonamide Based Sensing Materials for the Detection of CEES in SAW Sensor
The 6th International Conference on Active Materials and Soft Mechatronics
Thermography Based Monitoring System for High Voltage Electrical Equipment