발행물
컨퍼런스
Electronics Packaging Technology Conference
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A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk
IEEE International Symposium on Electromagnetic Compatibility
Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board
Electronic Components & Technology Conference
High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package
Electronics Manufacturing Technology Symposium
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls