발행물

전체 논문

138

111

Optimized shield design for reduction of EMF from wireless power transfer systems
Ahn, S[Ahn, Seungyoung], Park, HH[Park, Hyun Ho], Hwang, C[Hwang, Chulsoon]
IEICE ELECTRONICS EXPRESS, 201402

112

Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel
Shin, MC[Shin, Min-Chul], Kim, M[Kim, Myunghoi], Kim, JS[Kim, Ji-Seong], Kim, Joungho, Ahn, S[Ahn, Seungyoung]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201401

113

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System
Kim, JS[Kim, Ji Seong], Kim, JH[Kim, Jong Hoon], Kong, S[Kong, Sunkyu], Kim, H[Kim, Hongseok], Suh, IS[Suh, In-Soo], Suh, NP[Suh, Nam Pyo], Cho, Dong-Ho, Kim, Joungho, Ahn, S[Ahn, Seungyoung]
PROCEEDINGS OF THE IEEE, 201306

114

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs
Kim, MH[Kim, Myung-Hoi], Koo, KC[Koo, Kyoung-Choul], Shim, YJ[Shim, Yu-Jeong], Hwang, CS[Hwang, Chul-Soon], Pak, JS[Pak, Jun-So], Ahn, SY[Ahn, Seung-Young], Kim, Joung-Ho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201304

115

CHARGING UP THE ROAD
Ahn, S[Ahn, Seungyoung], Suh, NP[Suh, Nam Pyo], Cho, Dong-Ho
IEEE SPECTRUM, 201304

116

Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects
Cho, JH[Cho, Jeonghyeon], Song, EH[Song, Eak-Hwan], Kim, HG[Kim, Hee-Gon], Ahn, SY[Ahn, Seung-Young], Pak, JS[Pak, Jun-So], Kim, JS[Kim, Ji-Seong], Kim, Joung-Ho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201108

117

Mitigation of noise coupling on RF cable using electromagnetic bandgap structures
Park, HH, Ahn, S[Ahn, Seungyoung]
ELECTRONICS LETTERS, 201107

118

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
Pak, JS[Pak, Jun-So], Kim, JH[Kim, Joo-Hee], Cho, JH[Cho, Jong-Hyun], Kim, KY[Kim, Ki-Yeong], Song, TG[Song, Tai-Gon], Ahn, SY[Ahn, Seung-Young], Lee, JH[Lee, Jun-Ho], Lee, HD[Lee, Hyung-Dong], Park, KW[Park, Kun-Woo], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201102

119

Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement
Lee, J, Ahn, S[Ahn, Seungyoung], Kwon, WS, Paik, Kyung-Wook, Kim, J
IEICE TRANSACTIONS ON ELECTRONICS, 200409

120

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer
Ahn, S[Ahn, Seungyoung], Lee, J[Lee, Junho], Kim, Joungho, Ryu, W[Ryu, Woonghwan], Kum, BH[Kum, Byung-Hun], Choi, HS, Yoon, CK
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200302