전산재료과학 연구실
포항공과대학교 본교(제1캠퍼스) 신소재공학과
이병주 교수
Computational Materials Design
Phase Field Simulation
Interatomic Potential Database
발행물
전체 논문
81
21
Local composition detouring for defect-free compositionally graded materials in additive manufacturing
E.S. Kim, J.M. Park, G.M. Karthik, K.T. Kim, J.-H. Yu, B.-J. Lee, Hyoung Seop Kim
Materials Research Letters, 2023
22
High-density nanoprecipitates and phase reversion via maraging enable ultrastrong yet strain-hardenable medium-entropy alloy
H. Kwon, P. Sathiyamoorthi, M.K. Gangaraju, A. Zargarand, J. Wang, Y.-U. Heo, S. Harjo, W. Gong, B.-J. Lee, H.S. Kim
Acta Mater., 2023
23
A Neural Network Model for High Entropy Alloy Design
Jaemin Wang, Hyeonseok Kwon, Hyoung Seop Kim, Byeong-Joo Lee
NPJ Computational Materials, 2023
24
A thermodynamic approach to the precipitation hardening of magnesium alloy with high formability
Jong-Kwan Lee, Hyo-Sun Jang, Alireza Zargaran, Antonio João Seco Ferreira Tapia, Nack Joon Kim, Byeong-Joo Lee
Scripta Mater., 2023
25
Analyzing the effect of Li/Ni intermixing on Ni-rich layered cathode structures using atomistic simulation of the Li-Ni-Mn-Co-O quinary system
Joonho Ji, Byeong-Joo Lee
J. Power Sources, 2023
26
Doubled strength and ductility via maraging effect and dynamic precipitate transformation in ultrastrong medium-entropy alloy
H. Chung, W.S. Choi, H. Jun, H.-S. Do, B.-J. Lee, P.-P. Choi, H.N. Han, W.-S. Ko, S.S. Sohn
Nature Communications, 2023
27
Effects of deformation-induced martensitic transformation on quasi-static and dynamic compressive properties of metastable SiVCrMnFeCo high-entropy alloys
D.G. Kim, M.C. Jo, H.S. Kim, B.-J. Lee, S. Lee, S.S. Sohn
J. Alloys and Compds., 2023
28
A full-scale Monte Carlo Potts model and real time conversion under non-uniform temperature distribution
Sang-Ho Oh, Matae Lee, Byeong-Joo Lee
Materials & Design, 2023
29
Si-addition contributes to overcoming the strength-ductility trade-off in high-entropy alloys
D. Wei, W. Gong, T. Tsuru, I. Lobzenko, X. Li, S. Harjo, T. Kawasaki, H.S. Do, J.W. Bae, C. Wagner, G. Laplanche, Y. Koizumi, H. Adachi, K. Aoyagi, A. Chiba, B.-J. Lee, H.S. Kim, H. Kato
Int. J. Plasticity, 2022
30
Prediction of interfacial reaction between Cu and In during low-temperature soldering
Sang-Ho Oh, Kunmo Chu, Byeong-Joo Lee
J. Phase Equilibria & Diffusion, 2022