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Article|
·
인용수 1
·2025
Novel surface finish with nanometer-thick Al2O3 layers via atomic layer deposition process: Properties of solder joint for advanced semiconductor packaging
Eun-Chae Noh, Min Jeong Kim, Se Young Oh, Byungjin Cho, Jeong‐Won Yoon
IF 5.5 (2025) Materials Characterization
키워드
SolderingIntermetallicLayer (electronics)NucleationDiffusion barrierMicrostructureAtomic diffusionDeposition (geology)Surface finishTemperature cycling
타입
Article
IF / 인용수
5.5 / 1
원문
https://doi.org/10.1016/j.matchar.2025.115690
게재 연도
2025