발행물
컨퍼런스
Fall Meeting Held by Polymer Society of Korea
2025.10
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Curing Kinetics, Processability, and Thermal Behavior of End-Capped Imide-Based Thermosets with Different Backbone Conformations
Seminar at Pohang University of Science and Technology (POSTECH)
2025.08
Fundamental Insight on Developing Low Dielectric Polyimides for Electronics Packaging and Interconnection
Spring Meeting Held by Polymer Society of Korea
2025.04
High-Frequency Dielectric Behaviors of Porous Polyimides
4th Dornbirn GFC-ASIA
PMR-Type Polyimide Resin for Ultra-High-Temperature Fiber-Reinforced Plastics
Fall Meeting Held by Korean Fiber Society
2024.10
Fundamental Insight on Developing Low Dielectric Insulating Materials