발행물
컨퍼런스
IEEE 67th Electronic Components and Technology Conference (ECTC)
2017
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Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications
SID 2017
Optimization of Multilayer Inorganic/Organic Thin Film Structure for Foldable Barrier Films
한국반도체디스플레이기술학회 2017년도 춘계학술대회
FEM 시뮬레이션을 이용한 단결정 실리콘 소자의 변형률 분석
2017 International Conference on Electronics Packaging, ICEP 2017
FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing
Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards