발행물
컨퍼런스
2024 IMID
2024
,
Extreme Temperature Durable Hyperelastic Adhesive Forming Multiple Neutral Planes
GPVC 2024
Tetramerized small-molecule acceptor for organic solar cells with enhanced efficiency, stability and mechanical robustness: Impact of chain length and dispersity effects
The 14th International Symposium on NDT in Aerospace (AeroNDT2023)
2023
Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition
The 21st International Symposium on Microelectronics and Packaging (ISMP)
Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging
Prediction of Wiggling Phenomenon in High Aspect Ratio Thin Film Structure During Etching Process through Buckling-Based Dimensional Analysis