발행물
컨퍼런스
The 21st International Symposium on Microelectronics and Packaging (ISMP)
2023
,
Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics
MPC 2023 추계 컨퍼런스
얇은 유리 섬유 강화 기판의 유리 섬유 층 수에 따른 고온 인장 탄성 계수 변화 양상
Advanced Epitaxy for Freestanding Membranes and 2D Materials Conference, AEFM 2023
Fabrication of Robust Freestanding Gold Membrane by Heat Treatment
ICEM20 - 20th International Conference on Experimental Mechanics
Mechanical Properties of TEOS Thin Film
Elucidating Thickness-Dependent Plane Stress Fracture Toughness of Ultra-Thin Nanocrystalline Gold Films