발행물

전체 논문

92

1

Immiscible Binary Organic Phase Change Materials Composite with Segregated Thermally Conductive Filler Structure for Efficient Heat Dissipation
D. Lee, S.-k. Ahn, C.B. Kim*
2025

2

Polarity-Switchable Maleic Anhydride Copolymer for an Eco-Friendly Waterborne Multifunctional Anti-Icing Coating
S. An+, J.M. Lee+, J. Lee, S. Wooh*, C.B. Kim*
2025

3

Data-Driven Engineering and Analysis of Polymer Composites with High Thermal Conductivity
C. Na+, S. Shin+, Y. Yoon, S.-k. Ahn, H. An*, J. Lee*, C.B. Kim*
2025

4

Fully Recyclable, Catalyst-Free, Highly Adhesive, and Resilient Poly(β-Amino Esters) Covalent Adaptable Network-Based Solid Polymer Electrolyte for Lithium Metal Batteries
M. Yang+, Y. Jeon+, Y. Yoon, U.H. Choi*, C.B. Kim*
2025

5

Highly Conductive and Stretchable Liquid Metal-Hydrogel Composites Crosslinked by Glutaraldehyde
C. Park, J. Cheon, M. Lee, S. Lee, D. Shin, G.H. Choi, C.B. Kim, J.S. Park, B. Jeong*
2025

6

Light-Fueled In-Operando Shape Reconfiguration, Fixation, and Recovery of Magnetically Actuated Microtextured Covalent Adaptable Networks
Y. Yoon+, H. Moon+, W. Cho, D. Lee, S. Jeong*, J.J. Wie*, C.B. Kim*
Advanced Materials, 2025

7

CNT spacer-induced cooling crystallisation: a novel approach to mitigate membrane scaling in membrane distillation without chemicals
S. Jeong, B. Gu*, G.H. Choi, C.B. Kim, S. Jeong*
npj Clean Water, 2025

8

Structured Liquid-in-Liquid Emulsion Stabilized by Surface-Engineered Liquid Metal Droplets as “Mutant” Pickering Emulsifiers
J. Park, H. Lee, E. Na, T.S. Shim, C.B. Kim, H. Kim, G. Yu, J. Lee*
ACS Applied Materials & Interfaces, 2025

9

Effect of Thermal Oxidation of Carbon Nanotubes during Wet Spinning into Fibers Using Sodium Cholate Surfactant in Aqueous Dispersion
Y.H. Jeong, J. Im, G.H. Choi, C.B. Kim, J. Lee*
Materials, 2024.07

10

High-Yield-Stress Particle-Stabilized Emulsion for Form-Factor-Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability
S.-B. Min+, Y. Jo+, S.Y. Ryu, J. Lee*, C.-W. Ahn*, C.B. Kim*
Advanced Materials Interfaces, 2024.02