발행물
컨퍼런스
Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems
1970
,
Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity
Design and Measurement of a 28 GHz Glass Band Pass Filter based on Glass Interposers for 5G Applications
Modeling, Simulation and Measurement of On-chip Interconnects with Extremely Thin Si Substrate for Flexible Electronics
Proceedings of the 2019 Asia-Pacific Microwave Conference
Modeling and Verification of 3-Dimensional Resistive Storage Class Memory with High Speed Circuits for Core Operation
Proceedings of the 2019 IEEE Electrical Performance of Electronic Packaging and Systems (EPEPS)
Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box